POWER MODULE AND POWER CONVERSION DEVICE WITH THE SAME

PROBLEM TO BE SOLVED: To provide a power conversion device, at low cost, capable of performing temperature protection control so as to utilize performance of the power conversion device at a maximum while suppressing heating in a power semiconductor element even if a temperature and a flow rate of a coolant are varied.SOLUTION: A power module comprises: a semiconductor element; a first conductor plate which is connected with one electrode of the semiconductor element via a solder material; a second conductor plate which is disposed oppositely to the first conductor plate while interposing the semiconductor element therebetween and connected with another electrode of the semiconductor element via a solder material; an encapsulation material which encapsulates a part of the first conductor plate, a part of the second conductor plate and the semiconductor element; a case in which the encapsulation material is accommodated and which becomes a heat dissipation path of the semiconductor element; an insulation member which is disposed between the first conductor plate exposed from the encapsulation material and the case and brought into contact with the first conductor plate and an inner wall of the case; and a temperature detection element that is disposed on the inner wall of the case.SELECTED DRAWING: Figure 4(a) 【課題】冷却冷媒の温度及び流量に変動があっても、パワー半導体素子の発熱を抑制しながら電力変換装置の性能を最大限に利用することが可能な温度保護制御を行うことができる電力変換装置を低コストで実現することである。【解決手段】本発明に係るパワーモジュールは、半導体素子と、前記半導体素子の一方の電極とはんだ材を介して接続させる第１導体板と、前記半導体素子を挟んで前記第１導体板と対向して配置されかつ前記半導体素子の他方の電極とはんだ材を介して接続させる第２導体板と、前記第１導体板の一部と前記第２導体板の一部と前記半導体素子を封止する封止材と、前記封止材を収納しかつ前記半導体素子の放熱経路となるケースと、前記封止材から露出する前記第１導体板と前記ケースとの間に配置されかつ当該第１導体板及び当該ケースの内壁に接触する絶縁部材と、前記ケースの内壁に配置される温度検出素子と、を備える。【選択図】 図４（ａ）