CIRCUIT BOARD FIXING STRUCTURE

PROBLEM TO BE SOLVED: To provide a circuit board fixing structure capable of maintaining an insulation effect of a resist layer for a long period of time while a circuit board provided with a copper wiring and a resist layer is fixed to a fixing part made of a polyamide resin.SOLUTION: The circuit b...

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1. Verfasser: KONDO HIROTSUGU
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a circuit board fixing structure capable of maintaining an insulation effect of a resist layer for a long period of time while a circuit board provided with a copper wiring and a resist layer is fixed to a fixing part made of a polyamide resin.SOLUTION: The circuit board fixing structure includes: a circuit board 1 provided with a copper wiring 5 and a resist layer 6 that covers the copper wiring 5; and a fixing part 2c made of a polyamide resin fixed in a posture in which the circuit board 1 is brought in contact with a side of the resist layer 6. The copper wiring 5 is separated from a region 9 where the resist layer 6 and fixing part 2c are overlapped in a direction along a plate surface of the circuit board 1.SELECTED DRAWING: Figure 2 【課題】銅配線およびレジスト層が設けられた回路基板をポリアミド系樹脂製の固定部に固定してありながら、レジスト層の絶縁効果を長期に亘って維持できる回路基板固定構造を提供する。【解決手段】銅配線5および当該銅配線5を覆うレジスト層6が設けられた回路基板1と、回路基板1がレジスト層6の側を密接させる姿勢で固定されるポリアミド系樹脂製の固定部2cとを有し、銅配線5が、回路基板1の板面に沿う方向で、レジスト層6と固定部2cとの重なり領域9から離間している。【選択図】図2