METHOD FOR IRRADIATING PATTERN OF LIGHT

SOLUTION: To provide a method for irradiating a pattern of light comprising irradiating a pattern of light of ArF excimer laser as a light source using a halftone phase shift mask, in which the halftone phase shift mask comprises a transparent substrate, and a pattern of halftone phase shift film co...

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Hauptverfasser: HARAGUCHI TAKASHI, KOITABASHI RYUJI, YOSHIKAWA HIROKI, INAZUKI SADAOMI, KANEKO HIDEO, KOJIMA YOSUKE, HIROSE TOMOKAZU
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:SOLUTION: To provide a method for irradiating a pattern of light comprising irradiating a pattern of light of ArF excimer laser as a light source using a halftone phase shift mask, in which the halftone phase shift mask comprises a transparent substrate, and a pattern of halftone phase shift film composed of a material comprising molybdenum, silicon, nitrogen, and oxygen where the composition of the pattern of the halftone phase shift film comprises an atomic ratio of molybdenum to silicon (Met/Si) of 0.18 or more and 0.25 or less, a nitrogen content of 25 atom% or more and 50 atom% or less, and an oxygen content of 5 atom% or more and 20 atom% or less; and the halftone phase shift film is subjected to defect correction treatment by high energy ray beam irradiation in a fluorine-based gas atmosphere, and is irradiated with an ArF excimer laser ray at cumulative of 10 kJ/cmor more.EFFECT: A long-term exposure of the pattern of light in optical lithography can be performed without significant degradation of pattern size variation of the pattern of light in comparison with a conventional method.SELECTED DRAWING: None 【解決手段】透明基板と、モリブデン、ケイ素、窒素及び酸素を含有する材料からなるハーフトーン位相シフト膜パターンとを有し、ハーフトーン位相シフト膜パターンの組成が、モリブデンとケイ素との原子比(Met/Si)が0.18以上0.25以下、窒素含有率が25原子%以上50原子%以下、かつ酸素含有率が5原子%以上20原子%以下であり、ハーフトーン位相シフト膜に、フッ素系ガス雰囲気中での高エネルギー線ビーム照射による欠陥修正処理をし、かつ累積10kJ/cm2以上のArFエキシマレーザー光が照射されたハーフトーン位相シフトマスクを用い、ArFエキシマレーザー光を光源として、光パターンを照射する。【効果】従来と比べて、光パターンの大幅なパターン寸法変動劣化なしに、光リソグラフィーにおける光パターン照射を長時間実施することができる。【選択図】なし