THERMOSETTING RESIN COMPOSITION FOR LIGHT REFLECTION, OPTICAL SEMICONDUCTOR ELEMENT MOUNTING SUBSTRATE PREPARED THEREWITH AND METHOD FOR PRODUCING THE SAME, AND OPTICAL SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for light reflection having sufficient light reflectance and moldability, and excellent thermal discoloration resistance, an optical semiconductor element mounting substrate prepared therewith and a method for producing the same, and...

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Bibliographische Detailangaben
Hauptverfasser: MATSUO TAKASHI, AYAMA KYOICHI, URASAKI NAOYUKI, KOTANI HAYATO
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for light reflection having sufficient light reflectance and moldability, and excellent thermal discoloration resistance, an optical semiconductor element mounting substrate prepared therewith and a method for producing the same, and an optical semiconductor device.SOLUTION: The present invention provides a thermosetting resin composition for light reflection comprising a silicone resin having a double-decker silsesquioxane skeleton, a curing catalyst and a white pigment, and an optical semiconductor element mounting substrate and an optical semiconductor device prepared therewith.SELECTED DRAWING: None 【課題】十分な光反射率及び成形加工性を有し、耐熱着色性に優れた光反射用熱硬化性樹脂組成物、それを用いた光半導体素子搭載用基板及びその製造方法、並びに、光半導体装置の提供。【解決手段】ダブルデッカー型シルセスキオキサン骨格を有するシリコーン樹脂、硬化触媒並びに白色顔料を配合した光反射用熱硬化性樹脂組成物及びそれを用いた光半導体素子搭載用基板並びに光半導体装置。【選択図】なし