PLASMA PROCESSING APPARATUS
PROBLEM TO BE SOLVED: To provide a plasma processing apparatus capable of stably generating plasma while protecting an inner surface of a processing container within the plasma processing apparatus.SOLUTION: The plasma processing apparatus comprises: a processing container 1; a table 3 that is dispo...
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a plasma processing apparatus capable of stably generating plasma while protecting an inner surface of a processing container within the plasma processing apparatus.SOLUTION: The plasma processing apparatus comprises: a processing container 1; a table 3 that is disposed within the processing container 1; a dielectric window 16 that is provided in the processing container 1; a slot plate 20 that is provided on the dielectric window 16; and an enclosure Q which surrounds a processing space between the table 3 and the dielectric window 16 and is formed from a dielectric. By inputting microwaves to the slot plate 20, the plasma is generated under the dielectric window 16 and processing is applied to a wafer W disposed on the table 3 by the plasma. Between the enclosure Q and a projection 16p, a predetermined first gap G1 is present.SELECTED DRAWING: Figure 5
【課題】 プラズマ処理装置内において、処理容器の内面を保護しつつ、プラズマが安定して発生させることが可能なプラズマ処理装置を提供する。【解決手段】このプラズマ処理装置は、処理容器1と、処理容器1内に配置された台3と、処理容器1に設けられた誘電体窓16と、誘電体窓16上に設けられたスロット板20と、台3と誘電体窓16との間の処理空間を囲む誘電体からなる包囲体Qとを備え、スロット板20にマイクロ波を入力することにより、誘電体窓16下にプラズマを発生させ、このプラズマにより、台3上に配置された基板Wに処理を施ものであり、包囲体Qと凸部16pとの間に所定の第1の隙間G1が存在する。【選択図】図5 |
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