RESIN COMPOSITION FOR SEMICONDUCTOR ADHESION AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a resin composition for semiconductor adhesion low in water absorption percentage and good in adhesive strength during heating and adhesive strength during heating after moisture absorption, and a semiconductor device excellent in solder reflow resistance.SOLUTION: There is provided a heat hardening type resin composition for semiconductor adhesion containing (A) a thermosetting resin, (B) an inorganic filler and (C) a silane coupling agent containing an epoxy group as essential components, and the (C) silane coupling agent containing the epoxy group is a compound represented by the following formula (1). (1), where R and R' are each independently an alkyl group having 1 to 4 carbon atoms, A is a bivalent organic group having 5 to 12 carbon atoms which may sandwich an oxygen atom and n is an integer of 1 to 3.SELECTED DRAWING: None 【課題】吸水率が低く、熱時接着強度及び吸湿後熱時接着強度が良好な半導体接着用樹脂組成物及び耐半田リフロー性に優れた半導体装置を提供する。【解決手段】（Ａ）熱硬化性樹脂と、（Ｂ）無機充填材と、（Ｃ）エポキシ基を含有するシランカップリング剤と、を必須成分とする半導体接着用熱硬化型樹脂組成物であって、（Ｃ）エポキシ基を含有するシランカップリング剤が、下記一般式（１）で表される化合物であることを特徴とする半導体接着用樹脂組成物。【化１】（式中、Ｒ及びＲ'はそれぞれ独立に炭素数１〜４のアルキル基であり、Ａは酸素原子を間に挟んでもよい炭素数５〜１２の２価の有機基であり、ｎは１〜３の整数である。）【選択図】なし