METHOD FOR POLISHING WORKPIECE

PROBLEM TO BE SOLVED: To provide a method for polishing workpiece that can perform processing steps of cutting and polishing with one kind of device.SOLUTION: In the method for polishing workpiece, a polishing tool 8 is mounted to a blade cover of a cutting device via a fixing plate 9, processing fe...

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Bibliographische Detailangaben
Hauptverfasser:	SAKAI TOSHIYUKI, MIHAI CHRIS
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for polishing workpiece that can perform processing steps of cutting and polishing with one kind of device.SOLUTION: In the method for polishing workpiece, a polishing tool 8 is mounted to a blade cover of a cutting device via a fixing plate 9, processing feed where a chuck table 2 is fed for processing in an X direction to polish the workpiece Wwith a polishing action surface 81 of the polishing tool 8 and indexing feed where the polishing tool 8 is fed for indexing on a side of the workpiece Ware repeated. The processing feed and the indexing feed are repeated till a desired polished surface is formed in the workpiece W.SELECTED DRAWING: Figure 2 【課題】切断と研磨の加工工程を１種類の装置で実施することができる被加工物の研磨方法を提供すること。【解決手段】切削装置のブレードカバーに固定プレート９を介して研磨工具８を装着し、チャックテーブル２をＸ軸方向に加工送りして被加工物Ｗｂを研磨工具８の研磨作用面８１で研磨する加工送りと、研磨工具８を被加工物Ｗｂ側に割り出し送りする割り出し送りとを繰り返す。加工送りと割り出し送りは、被加工物Ｗｂに所望の研磨面が形成されるまで繰り返す。【選択図】図２