SEMICONDUCTOR COOLER

PROBLEM TO BE SOLVED: To form a semiconductor cooler that has no risk of water leakage.SOLUTION: A semiconductor cooler 5 having no junction is configured by forming planar parts 20a, 20b, 20c by pressing and spreading middle parts 18a, 18b, 18c of a tubular member 10 planarly, substrates 30a, 30b, 30c on which heat generation type semiconductor elements 31a, 31b, 31c are mounted, are provided so as to abut on planar parts 20a, 20b, 20c, and a coolant flows between edges 12, 14 of both sides of the tubular member 10 to cool substrates 30a, 30b, 30c.SELECTED DRAWING: Figure 1 【課題】漏水の虞がない半導体冷却器を形成する。【解決手段】管状部材１０の中途部１８ａ，１８ｂ，１８ｃを平面状に押し広げて平面部２０ａ，２０ｂ，２０ｃを形成することによって、接合部のない半導体冷却器５を構成し、発熱型半導体素子３１ａ，３１ｂ，３１ｃが実装された基板３０ａ，３０ｂ，３０ｃを、それぞれ、平面部２０ａ，２０ｂ，２０ｃに当接して設置し、管状部材１０の両側の端部１２，１４の間に冷媒を流して基板３０ａ，３０ｂ，３０ｃを冷却する。【選択図】図１