SEMICONDUCTOR COOLING DEVICE

PROBLEM TO BE SOLVED: To prevent erosion of a coolant passage caused by high pressure applied when a coolant flows.SOLUTION: A semiconductor cooling device 10 comprises: a first direct advance part 12 and a second direct advance part 22 which have a plurality of coolant flow passages 11, 21 separate...

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Bibliographische Detailangaben
Hauptverfasser:	OKUZUKA HAJIME, SUGAWARA HIROMASA, HAMASAKI YUICHI, YOSHIHARA TOSHIKAZU, OI YASUYUKI, KOBAYASHI HIDETAKA, SAWAGUCHI MASA, KOGANEZAWA MASAKATSU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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