SEMICONDUCTOR COOLING DEVICE

PROBLEM TO BE SOLVED: To prevent erosion of a coolant passage caused by high pressure applied when a coolant flows.SOLUTION: A semiconductor cooling device 10 comprises: a first direct advance part 12 and a second direct advance part 22 which have a plurality of coolant flow passages 11, 21 separated by a plurality of radiation fins 14, 24, respectively, and which are adjacent to each other; a coolant supply/discharge part 35 (a coolant supply part 34 for supplying a coolant to the first direct advance part 12 and a coolant discharge part 38 for discharging a coolant from the second direct advance part 22) which is joined to ends 14a, 24a of the first direct advance part 12 and the second direct advance part 22 on the same side; and a variable rib 50 for changing a separation position between the first direct advance part 12 and the second direct advance part 22 depending on a pressure of the coolant supplied from the coolant supply part 34.SELECTED DRAWING: Figure 1 【課題】冷媒が流れる際の高い圧力による冷媒流路の浸食を防止する。【解決手段】半導体冷却装置１０に、複数の放熱フィン１４、２４によって仕切られた複数の冷媒流路１１，２１をそれぞれ有し、互いに隣接する第１直進部１２と第２直進部２２と、第１直進部１２と第２直進部２２のそれぞれの同じ側の端部１４ａ，２４ａに接合される冷媒給排部３５（第１直進部１２に冷媒を供給する冷媒供給部３４と第２直進部２２からの冷媒の排出を行う冷媒排出部３８）と、冷媒供給部３４から供給される冷媒の圧力に応じて、第１直進部１２と第２直進部２２との仕切り位置を変更する可変リブ５０と、を設ける。【選択図】図１