SEMICONDUCTOR COOLING DEVICE

PROBLEM TO BE SOLVED: To easily connect different semiconductor cooling devices while absorbing variations in sizes of power modules and to surely cool each of the power modules.SOLUTION: A semiconductor cooling unit 20a in which an upper semiconductor cooling part 21a including an upper coolant flow channel 62a is abutted to a top face of a power module 22a in which a semiconductor 12a is encapsulated, and a lower semiconductor cooling part 23a including a lower coolant flow passage 60a is abutted to a bottom face, is connected with a different semiconductor cooling unit 20b in the same configuration by a first connection part 24a provided in one end of the semiconductor cooling unit 20a and including a coolant outflow port 34a, a size difference absorption surface 35a surrounding the coolant outflow port 34a, a step part 36a forming an outer edge of the size difference absorption surface 35a, and a first flange surface 37a surrounding the step part 36a, and a second connection part 27a provided in one end of the semiconductor cooling unit 20b and including a coolant inflow port 42a and a second flange surface 43a surrounding the coolant inflow port 42a.SELECTED DRAWING: Figure 7 【課題】異なる半導体冷却装置を、パワーモジュールのサイズのばらつきを吸収して容易に接続し、なおかつ、個々のパワーモジュールを確実に冷却する。【解決手段】半導体１２ａを封止したパワーモジュール２２ａの上面に上部冷媒流路６２ａをもつ上部半導体冷却部２１ａを当接させ、下面に下部冷媒流路６０ａをもつ下部半導体冷却部２３ａを当接させた半導体冷却ユニット２０ａを、同じ構成の異なる半導体冷却ユニット２０ｂと、半導体冷却ユニット２０ａの一方の端部に設けた、冷媒流出口３４ａと、冷媒流出口３４ａを囲むサイズ差吸収面３５ａと、サイズ差吸収面３５ａの外縁をなす段差部３６ａと、段差部３６ａを囲む第１フランジ面３７ａと、を有する第１接続部２４ａと、半導体冷却ユニット２０ｂの一方の端部に設けた、冷媒流入口４２ａと、冷媒流入口４２ａを囲む第２フランジ面４３ａと、を有する第２接続部２７ａと、で接続する。【選択図】図７