MANUFACTURING METHOD OF PATTERN FORMATION SUBSTRATE, PRACTICE SUBSTRATE, AND SUBSTRATE ASSEMBLY

PROBLEM TO BE SOLVED: To provide a manufacturing method of a pattern formation substrate capable of improving a yield of the pattern formation substrate.SOLUTION: A step structure 23 of a practice substrate 20 having a substrate body 21 and the step structure 23, projecting from the substrate body 2...

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Bibliographische Detailangaben
Hauptverfasser:	HARADA SABURO, NAGAI TAKAHARU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a manufacturing method of a pattern formation substrate capable of improving a yield of the pattern formation substrate.SOLUTION: A step structure 23 of a practice substrate 20 having a substrate body 21 and the step structure 23, projecting from the substrate body 21, provided on a surface with a pattern area 22 is made larger than a step structure 13 of a substrate 10 to be imprinted in plan view. After a practice imprint step using the practice substrate 20, a production imprint step to the substrate 10 to be imprinted is executed.SELECTED DRAWING: Figure 2 【課題】パターン形成基板の歩留まりを向上させることができるパターン形成基板の製造方法を提供する。【解決手段】基板本体２１と、基板本体２１から突出するとともに表面にパターン領域２２が設けられた段差構造２３とを有する慣らし用基板２０の段差構造２３を、平面視で、被転写基板１０の段差構造１３よりも大きくする。慣らし用基板２０を用いた慣らしインプリント工程の後に、被転写基板１０に対する本番インプリント工程を行う。【選択図】図２