SEMICONDUCTOR LIGHT-EMITTING DEVICE AND LEAD FRAME
PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device capable of increasing light extraction efficiency, and a lead frame.SOLUTION: A chip 20 is mounted on a lead frame 11 and has a substrate and a light-emitting element provided on the substrate. A wall part 33 has an inner wall fa...
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device capable of increasing light extraction efficiency, and a lead frame.SOLUTION: A chip 20 is mounted on a lead frame 11 and has a substrate and a light-emitting element provided on the substrate. A wall part 33 has an inner wall facing a side part of the chip 20, and an outer wall opposite to the inner wall. A phosphor layer 60 is provided at least on the chip 20. A distance between the side part of the chip 20 and the inner wall of the wall part 33 is smaller than the thickness of the chip 20. An angle formed by an upper surface of the lead frame 11 and the inner wall is smaller than an angle formed by the upper surface of the lead frame 11 and the outer wall.SELECTED DRAWING: Figure 1
【課題】光取り出し効率を高くできる半導体発光装置及びリードフレームを提供する。【解決手段】チップ20は、リードフレーム11上に搭載され、基板と、基板上に設けられた発光素子とを有する。壁部33は、チップ20の側部に対向する内壁と、内壁の反対側の外壁とを有する。蛍光体層60は、少なくともチップ20の上に設けられている。チップ20の側部と、壁部33の内壁との間の距離は、チップ20の厚さよりも小さい。リードフレーム11の上面と内壁とがなす角は、リードフレームの上面と外壁とがなす角よりも小さい。【選択図】図1 |
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