HEAT DISSIPATION STRUCTURE OF ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To provide a heat dissipation structure of an electronic apparatus which allows for efficient heat dissipation from a heat generating portion of a substrate, while reducing the cost and saving the space.SOLUTION: A heat dissipation structure of an electronic apparatus 1 include...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MURAMATSU SATOSHI, MIFUNE FUMITOMO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!