HEAT DISSIPATION STRUCTURE OF ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To provide a heat dissipation structure of an electronic apparatus which allows for efficient heat dissipation from a heat generating portion of a substrate, while reducing the cost and saving the space.SOLUTION: A heat dissipation structure of an electronic apparatus 1 includes a housing 10, a partition plate 30 coupled with the inside surface 100 of the housing 10 via a coupling member 20, and a first substrate 50 attached to the first surface 300 of the partition plate 30 via a first attachment member 40. The partition plate 30 has a first heat dissipation member 310 protruded from the first surface 300, and the first heat dissipation member 310 abuts against a CPU500, as one example of a heat generating portion of the first substrate 50.SELECTED DRAWING: Figure 5 【課題】基板の発熱箇所の放熱が効率的にでき、コストダウン、省スペース化を実現できる電子機器の放熱構造を提供すること。【解決手段】電子機器１の放熱構造であって、筐体１０と、筐体１０の内側表面１００に連結部材２０を介して連結された仕切板３０と、仕切板３０の第１の面３００に第１の取付部材４０を介して取付けられた第１の基板５０とを備え、仕切板３０が第１の面３００に突設された第１の放熱部材３１０を有し、第１の放熱部材３１０が第１の基板５０の発熱箇所の一例としてのＣＰＵ５００に当接する。【選択図】図５