HEAT DISSIPATION STRUCTURE OF ELECTRONIC APPARATUS
PROBLEM TO BE SOLVED: To provide a heat dissipation structure of an electronic apparatus which allows for efficient heat dissipation from a heat generating portion of a substrate, while reducing the cost and saving the space.SOLUTION: A heat dissipation structure of an electronic apparatus 1 include...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; jpn |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | MURAMATSU SATOSHI MIFUNE FUMITOMO |
| description | PROBLEM TO BE SOLVED: To provide a heat dissipation structure of an electronic apparatus which allows for efficient heat dissipation from a heat generating portion of a substrate, while reducing the cost and saving the space.SOLUTION: A heat dissipation structure of an electronic apparatus 1 includes a housing 10, a partition plate 30 coupled with the inside surface 100 of the housing 10 via a coupling member 20, and a first substrate 50 attached to the first surface 300 of the partition plate 30 via a first attachment member 40. The partition plate 30 has a first heat dissipation member 310 protruded from the first surface 300, and the first heat dissipation member 310 abuts against a CPU500, as one example of a heat generating portion of the first substrate 50.SELECTED DRAWING: Figure 5
【課題】基板の発熱箇所の放熱が効率的にでき、コストダウン、省スペース化を実現できる電子機器の放熱構造を提供すること。【解決手段】電子機器１の放熱構造であって、筐体１０と、筐体１０の内側表面１００に連結部材２０を介して連結された仕切板３０と、仕切板３０の第１の面３００に第１の取付部材４０を介して取付けられた第１の基板５０とを備え、仕切板３０が第１の面３００に突設された第１の放熱部材３１０を有し、第１の放熱部材３１０が第１の基板５０の発熱箇所の一例としてのＣＰＵ５００に当接する。【選択図】図５ |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2016063055A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2016063055A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2016063055A3</originalsourceid><addsrcrecordid>eNrjZDDycHUMUXDxDA72DHAM8fT3UwgOCQp1DgkNclXwd1Nw9XF1Dgny9_N0VnAMCHAMcgwJDeZhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGhmYGZsYGpqaOxkQpAgDnWieN</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>HEAT DISSIPATION STRUCTURE OF ELECTRONIC APPARATUS</title><source>esp@cenet</source><creator>MURAMATSU SATOSHI ; MIFUNE FUMITOMO</creator><creatorcontrib>MURAMATSU SATOSHI ; MIFUNE FUMITOMO</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a heat dissipation structure of an electronic apparatus which allows for efficient heat dissipation from a heat generating portion of a substrate, while reducing the cost and saving the space.SOLUTION: A heat dissipation structure of an electronic apparatus 1 includes a housing 10, a partition plate 30 coupled with the inside surface 100 of the housing 10 via a coupling member 20, and a first substrate 50 attached to the first surface 300 of the partition plate 30 via a first attachment member 40. The partition plate 30 has a first heat dissipation member 310 protruded from the first surface 300, and the first heat dissipation member 310 abuts against a CPU500, as one example of a heat generating portion of the first substrate 50.SELECTED DRAWING: Figure 5
【課題】基板の発熱箇所の放熱が効率的にでき、コストダウン、省スペース化を実現できる電子機器の放熱構造を提供すること。【解決手段】電子機器１の放熱構造であって、筐体１０と、筐体１０の内側表面１００に連結部材２０を介して連結された仕切板３０と、仕切板３０の第１の面３００に第１の取付部材４０を介して取付けられた第１の基板５０とを備え、仕切板３０が第１の面３００に突設された第１の放熱部材３１０を有し、第１の放熱部材３１０が第１の基板５０の発熱箇所の一例としてのＣＰＵ５００に当接する。【選択図】図５</description><language>eng ; jpn</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160425&DB=EPODOC&CC=JP&NR=2016063055A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160425&DB=EPODOC&CC=JP&NR=2016063055A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MURAMATSU SATOSHI</creatorcontrib><creatorcontrib>MIFUNE FUMITOMO</creatorcontrib><title>HEAT DISSIPATION STRUCTURE OF ELECTRONIC APPARATUS</title><description>PROBLEM TO BE SOLVED: To provide a heat dissipation structure of an electronic apparatus which allows for efficient heat dissipation from a heat generating portion of a substrate, while reducing the cost and saving the space.SOLUTION: A heat dissipation structure of an electronic apparatus 1 includes a housing 10, a partition plate 30 coupled with the inside surface 100 of the housing 10 via a coupling member 20, and a first substrate 50 attached to the first surface 300 of the partition plate 30 via a first attachment member 40. The partition plate 30 has a first heat dissipation member 310 protruded from the first surface 300, and the first heat dissipation member 310 abuts against a CPU500, as one example of a heat generating portion of the first substrate 50.SELECTED DRAWING: Figure 5
【課題】基板の発熱箇所の放熱が効率的にでき、コストダウン、省スペース化を実現できる電子機器の放熱構造を提供すること。【解決手段】電子機器１の放熱構造であって、筐体１０と、筐体１０の内側表面１００に連結部材２０を介して連結された仕切板３０と、仕切板３０の第１の面３００に第１の取付部材４０を介して取付けられた第１の基板５０とを備え、仕切板３０が第１の面３００に突設された第１の放熱部材３１０を有し、第１の放熱部材３１０が第１の基板５０の発熱箇所の一例としてのＣＰＵ５００に当接する。【選択図】図５</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDDycHUMUXDxDA72DHAM8fT3UwgOCQp1DgkNclXwd1Nw9XF1Dgny9_N0VnAMCHAMcgwJDeZhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGhmYGZsYGpqaOxkQpAgDnWieN</recordid><startdate>20160425</startdate><enddate>20160425</enddate><creator>MURAMATSU SATOSHI</creator><creator>MIFUNE FUMITOMO</creator><scope>EVB</scope></search><sort><creationdate>20160425</creationdate><title>HEAT DISSIPATION STRUCTURE OF ELECTRONIC APPARATUS</title><author>MURAMATSU SATOSHI ; MIFUNE FUMITOMO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2016063055A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2016</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>MURAMATSU SATOSHI</creatorcontrib><creatorcontrib>MIFUNE FUMITOMO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MURAMATSU SATOSHI</au><au>MIFUNE FUMITOMO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HEAT DISSIPATION STRUCTURE OF ELECTRONIC APPARATUS</title><date>2016-04-25</date><risdate>2016</risdate><abstract>PROBLEM TO BE SOLVED: To provide a heat dissipation structure of an electronic apparatus which allows for efficient heat dissipation from a heat generating portion of a substrate, while reducing the cost and saving the space.SOLUTION: A heat dissipation structure of an electronic apparatus 1 includes a housing 10, a partition plate 30 coupled with the inside surface 100 of the housing 10 via a coupling member 20, and a first substrate 50 attached to the first surface 300 of the partition plate 30 via a first attachment member 40. The partition plate 30 has a first heat dissipation member 310 protruded from the first surface 300, and the first heat dissipation member 310 abuts against a CPU500, as one example of a heat generating portion of the first substrate 50.SELECTED DRAWING: Figure 5
【課題】基板の発熱箇所の放熱が効率的にでき、コストダウン、省スペース化を実現できる電子機器の放熱構造を提供すること。【解決手段】電子機器１の放熱構造であって、筐体１０と、筐体１０の内側表面１００に連結部材２０を介して連結された仕切板３０と、仕切板３０の第１の面３００に第１の取付部材４０を介して取付けられた第１の基板５０とを備え、仕切板３０が第１の面３００に突設された第１の放熱部材３１０を有し、第１の放熱部材３１０が第１の基板５０の発熱箇所の一例としてのＣＰＵ５００に当接する。【選択図】図５</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; jpn |
| recordid | cdi_epo_espacenet_JP2016063055A |
| source | esp@cenet |
| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | HEAT DISSIPATION STRUCTURE OF ELECTRONIC APPARATUS |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-25T16%3A48%3A09IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MURAMATSU%20SATOSHI&rft.date=2016-04-25&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2016063055A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |