WIRING BOARD AND MANUFACTURING METHOD OF THE SAME

PROBLEM TO BE SOLVED: To provide a wiring board and the like which has a shield structure capable of implementing appropriate EMI prevention in a wiring board which transmits a differential signal.SOLUTION: A wiring board 1 of the present embodiment comprises: a board body 1a including a transmission line 15 for a differential signal; wiring conductors 16 for plating each having an end face being exposed on a lateral face of the board body 1a; an insulation layer 20 formed to at least cover the end faces of the wiring conductors 16 for plating; and a conductor layer 21 which is formed to surround the lateral faces of the board body 1a across the insulation layer 20 and electrically insulated from a conductor part of the board body 1a.SELECTED DRAWING: Figure 1 【課題】差動信号を伝送する配線基板おいて適切なＥＭＩ対策を施すことが可能なシールド構造を有する配線基板等を提供する。【解決手段】本発明の配線基板１は、差動信号の伝送線路１５を含む基板本体１ａと、この基板本体１ａの側面に端面が露出したメッキ用配線導体１６と、少なくともメッキ用配線導体１６の端面を覆って形成された絶縁層２０と、この絶縁層２０を挟んで基板本体１ａの側面を取り囲んで形成され、基板本体１ａの導体部と電気的に分離された導体層２１とを備えて構成される。【選択図】図１