RFID TAG

PROBLEM TO BE SOLVED: To provide an RFID tag capable of preventing a semiconductor chip from being broken.SOLUTION: The RFID tag includes: a base material; a semiconductor chip mounted on the base material; and an island-like reinforcement material 26 which covers the semiconductor chip, having a gr...

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Bibliographische Detailangaben
Hauptverfasser: NIWADA TAKESHI, SUGIMURA YOSHIYASU, MATSUMURA TAKAYOSHI, MIURA AKIHIRA, BABA SHUNJI
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide an RFID tag capable of preventing a semiconductor chip from being broken.SOLUTION: The RFID tag includes: a base material; a semiconductor chip mounted on the base material; and an island-like reinforcement material 26 which covers the semiconductor chip, having a groove 26x which functions as a start point of a fold line L, which is formed when the reinforcement material 26 is folded, is formed in a side part 26a so that the fold line Lis not positioned on a semiconductor chip mount area R.SELECTED DRAWING: Figure 12 【課題】半導体チップが割れるのを防止するRFIDタグを提供する。【解決手段】基材と、基材の上に搭載された半導体チップと、半導体チップを覆うと共に、折り曲げたときにできる折り曲げ線L0が半導体チップ搭載領域Rから外れるように折り曲げ線L0の起点となる凹み26xを側部26aに備え、かつ、基材を補強する島状の補強材26とを有する。【選択図】図12