HEAT INSULATION LAYER

PROBLEM TO BE SOLVED: To solve the following problem: the thickness of a heat insulation layer 11 becomes ununiform due to a liquid sag of a heat insulation material applied to a base material 1.SOLUTION: A heat insulation layer 11 includes a large number of spherical hollow particles 12, and a binder 13 that forms a base material for the heat insulation layer 11 by retaining the spherical hollow particles 12 in the base material 1 and filling spaces among the spherical hollow particles. A large number of second particles 15, the surfaces of which each have irregularities or a functional group coupled to the binder 13 and which are smaller in particle diameter than the hollow particle 12, are added to the binder 13.SELECTED DRAWING: Figure 3 【課題】基材１に塗布した断熱材料の液ダレによって断熱層１１の厚さが不均一になる問題を解決する。【解決手段】断熱層１１は、多数の球状中空粒子１２と、中空粒子１２を基材１に保持すると共に中空粒子間を埋めて当該断熱層１１の母材を形成するバインダ１３とを備え、バインダ１３に、表面に凹凸を有し又は表面にバインダ１３と結合する官能基を有し且つ中空粒子１２よりも粒径が小さい多数の第２粒子１５が添加されている。【選択図】図３