RESIN COMPOSITION FOR ELECTRONIC CIRCUIT BOARD MATERIAL, PREPREG, LAMINATE SHEET AND METAL CLAD LAMINATE SHEET

PROBLEM TO BE SOLVED: To provide a resin composition for electronic circuit board material excellent in moldability, high in glass transition temperature (Tg) of a cured article, and capable of reducing warpage when manufacturing a semiconductor package.SOLUTION: There is provided a resin composition containing (A) a novolak phenol resin of the formula (1) having two or more hydroxyl groups in a molecule and a naphthalene skeleton having at least one or more hydroxyl groups of the hydroxyl groups, (B) an epoxy resin having two or more epoxy groups in a molecule, and (C) an inorganic filler with a content of 130 to 250 pts.mass based on 100 pts.mass of the (A) and (B) components. The composition has a glass transition temperature (Tg) after curing of 220°C or more.SELECTED DRAWING: None 【課題】成形性に優れ、硬化物のガラス転移温度（Ｔｇ）が高く、半導体パッケージを製造した場合にその反りを低減することができる電子回路基板材料用樹脂組成物。【解決手段】（Ａ）分子内に２つ以上の水酸基を有し、かつ水酸基のうち少なくとも１つ以上の水酸基を有するナフタレン骨格を持つ式（１）のノボラックフェノール樹脂（Ｂ）分子内に２つ以上のエポキシ基を有するエポキシ樹脂（Ａ）及び（Ｂ）成分１００質量部に対する（Ｃ）無機充填剤の含有量が１３０〜２５０質量部である樹脂組成物。既組成物は硬化後のガラス転移温度（Ｔｇ）が２２０℃以上。【選択図】なし