MULTILAYER WIRING BOARD AND PROBE CARD EQUIPPED WITH MULTILAYER WIRING BOARD

PROBLEM TO BE SOLVED: To improve the bond strength of a core board and a stud provided protruding from the principal surface of the core board in a multilayer wiring board with which a probe card is provided.SOLUTION: A multilayer wiring board 2a of a probe card 1 comprises: a core board 8 one princ...

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1. Verfasser:	TAKEMURA TADAHARU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS PRINTED CIRCUITS TESTING
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