MULTILAYER WIRING BOARD AND PROBE CARD EQUIPPED WITH MULTILAYER WIRING BOARD

PROBLEM TO BE SOLVED: To improve the bond strength of a core board and a stud provided protruding from the principal surface of the core board in a multilayer wiring board with which a probe card is provided.SOLUTION: A multilayer wiring board 2a of a probe card 1 comprises: a core board 8 one principal surface of which is disposed so as to face a mother board 3 of the probe card 1 and other principal surface has a plurality of inspection probe pins 5 connected thereto; a stud 13 provided in such a way that one end of which protrudes from the one principal surface of the core board 8, a recess 14 formed in the one principal surface of the core board 8 and in which the other end of the stud 13 is disposed; and a metal film 15 formed on the inner wall surfaces 14a, 14b of the recess 14. The principal surface side of the core board 8 is formed with a ceramic layer, and the other end of the stud 13 and the metal film 15 is joined together by a solder material 15 provided in the recess 14.SELECTED DRAWING: Figure 1 【課題】プローブカードが備える積層配線基板において、コア基板と、該コア基板の主面から突出して設けられるスタッドとの接合強度の向上を図る。【解決手段】プローブカード１が備える積層配線基板２ａは、その一方主面がプローブカード１のマザー基板３に対向するように配置され、その他方主面に複数の検査用プローブピン５が接続されるコア基板８と、該コア基板８の一方主面から一端側が突出して設けられるスタッド１３と、コア基板８の一方主面に形成されてスタッド１３の他端が配置される凹部１４と、該凹部１４の内壁面１４ａ，１４ｂに形成された金属膜１５とを備え、コア基板８の一方主面側はセラミック層で形成され、スタッド１３の他端と金属膜１５とが、凹部１４に設けられたろう材１５により接合されている。【選択図】図１