CIRCUIT DEVICE HAVING THREE-DIMENSIONAL WIRING, METHOD FOR FORMING THREE-DIMENSIONAL WIRING, AND A COMPOSITION FOR METAL FILM FORMATION FOR THREE-DIMENSIONAL WIRING

PROBLEM TO BE SOLVED: To provide a circuit device having three-dimensional wiring with good conductivity, which makes possible to readily manufacture the three-dimensional wiring with a relatively high productivity at a relatively low manufacturing cost.SOLUTION: A silicon through wiring board 1 hav...

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Hauptverfasser:	KOBAYASHI ATSUSHI, OKITA KENZO, ARITOME ISAO, MATSUMOTO TAICHI, SHIMODA SUGIO, WATABE KAZUTO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES
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