PREPREG, METAL CLAD LAMINATED BOARD AND PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a prepreg capable of achieving inhibition of powder drop and reduction of CTE while maintaining good moldability.SOLUTION: A prepreg has a fiber substrate and a thermosetting resin composition impregnated into the fiber substrate. The thermosetting resin composition...

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Hauptverfasser: YONEMOTO TATSUO, MATSUMOTO MASAAKI, MITO TAKATOSHI
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a prepreg capable of achieving inhibition of powder drop and reduction of CTE while maintaining good moldability.SOLUTION: A prepreg has a fiber substrate and a thermosetting resin composition impregnated into the fiber substrate. The thermosetting resin composition contains a thermosetting resin containing an epoxy resin, a curing agent, an inorganic filler and an acrylic acid ester copolymer having weight average molecular weight of 10×10or more and less than 45×10. The content of the inorganic filler is 150 pts.mass or more based on total 100 pts.mass of the thermosetting resin and the curing agent. The content of the acrylic acid ester copolymer is more than 30 pts.mass and 90 pts.mass or less based on total 100 pts.mass of the thermosetting resin and the curing agent.SELECTED DRAWING: Figure 1 【課題】良好な成形性を確保しつつ粉落ちの抑制と低CTE化とを両立させることができるプリプレグを提供する。【解決手段】プリプレグは、繊維基材と、繊維基材に含浸した熱硬化性樹脂組成物とを有する。熱硬化性樹脂組成物は、エポキシ樹脂を含む熱硬化性樹脂と、硬化剤と、無機フィラーと、10?104以上、45?104未満の重量平均分子量を有するアクリル酸エステル共重合体とを含有する。無機フィラーの含有量は、熱硬化性樹脂と硬化剤の合計100質量部に対して150質量部以上である。アクリル酸エステル共重合体の含有量は、熱硬化性樹脂と硬化剤の合計100質量部に対して30質量部より多く、90質量部以下である。【選択図】図1