SUPPORT FOR MICROELECTRONIC, MICRO-OPTOELECTRONIC OR MICROMECHANICAL DEVICES

PROBLEM TO BE SOLVED: To make it easy to produce solid state devices.SOLUTION: The invention relates to a support for production of microelectronic, micro-optoelectronic or micromechanical devices. The support (10; 60) comprises a substrate (11; 61) having a function of a backing element, on the sub...

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Bibliographische Detailangaben
1. Verfasser:	AMIOTTI MARCO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES SEPARATION SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION THEIR RELEVANT APPARATUS TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To make it easy to produce solid state devices.SOLUTION: The invention relates to a support for production of microelectronic, micro-optoelectronic or micromechanical devices. The support (10; 60) comprises a substrate (11; 61) having a function of a backing element, on the substrate, gas absorbing material is deposited in form of discrete deposits (13, 13',...; 63, 63',...) that are at least partially exposed to atmosphere present around the support (10; 60).SELECTED DRAWING: Figure 1 【課題】固体デバイスの製造を簡単にすること。【解決手段】本発明は、マイクロエレクトロニクス、マイクロオプトエレクトロニクスまたはマイクロメカニクスのデバイスの製造のための支持体に関する。該支持体(10;60)は、裏打ち要素の機能を有する基板(11;61)を含み、その上に、気体吸収物質が別個の堆積物(13、13'、...;63、63'、...)の形状で堆積され、その堆積物は、該支持体(10;60)の周りに存在する大気に少なくとも一部暴露される。【選択図】図１