PROCESSING METHOD OF SUBSTRATE, PROCESSED SUBSTRATE, MANUFACTURING METHOD OF ELECTRONIC COMPONENT, ELECTRONIC COMPONENT, ELECTRONIC APPARATUS AND MOVABLE BODY

PROBLEM TO BE SOLVED: To provide a processing method of a substrate effectively preventing an unnecessary deposit from remaining on the substrate subsequent to dry etching while stably fixing the substrate at the time of dry etching, and further to provide a processed substrate having a desired pattern and preventing an unintended deposit from remaining.SOLUTION: A processing method of a substrate includes: a step 1a of fixing a substrate 1 being coated with a mask 4 with a predetermined pattern via a metal film 2 on a support member 3 and being constituted of an inorganic material; a dry etching step 1b of fixing the support member 3 to a stage 5 of a dry etching device and applying dry etching thereto in a state of the substrate 1 being supported by the support member 3 via the metal film 2; and a separating step 1c of dissolving a metallic material constituting the metal film 2 and separating the substrate 1 applied with the dry etching from the support member 3.SELECTED DRAWING: Figure 1 【課題】ドライエッチング時には基板を安定的に固定しつつ、ドライエッチング後に基板に不要な付着物が残存することを効果的に防止する基板の処理方法及び所望のパターンを有し且つ不本意な付着物の残存を防止した加工基板を提供する。【解決手段】支持部材３上に、金属膜２を介して、所定のパターンのマスク４で被覆され、無機材料で構成された基板１を固定する工程１ａと、基板１を、金属膜２を介して、支持部材３で支持した状態で支持部材３を、ドライエッチング装置のステージ５に固定してドライエッチングを施すドライエッチング工程１ｂと、金属膜２を構成する金属材料を溶解し、ドライエッチングが施された基板１を支持部材３から分離する分離工程１ｃと、を有する。【選択図】図１