COMPOSITION FOR COPPER FILM FORMATION, COPPER FILM, CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, AND ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To provide a composition for copper film formation for forming a copper film with an excellent stability, and a low resistance copper film, a circuit board having the copper film, a semiconductor package, and an electronic apparatus.SOLUTION: A composition for copper film formation used for forming a copper film is prepared by including at least one of an organic acid amine and an organic acid ammonium salt and a copper particle. A wiring of a circuit substrate or a semiconductor package is formed by using the composition for copper film formation to form a coating film on a substrate, the coating film then being heated under non-oxidation atmosphere to form a copper film. The composition for copper film formation is used to form a coating film on a transparent substrate 22 constructed on a first detection electrode 23 and a second detection electrode 24. The coating film is heated to form a drawing wiring 31 and a touch panel 21 as an electronic apparatus is produced.SELECTED DRAWING: Figure 1 【課題】安定性に優れて低抵抗の銅膜を形成できる銅膜形成用組成物を提供し、低抵抗の銅膜およびその銅膜を有する回路基板、半導体パッケージおよび電子機器を提供する。【解決手段】銅膜の形成に用いる銅膜形成用組成物を、有機酸アミン塩および有機酸アンモニウム塩のうちの少なくとも一方と、銅粒子とを含有させて調製する。その銅膜形成用組成物を用いて基材上に塗膜を形成し、非酸化性雰囲気下で加熱して銅膜を形成し、回路基板や半導体パッケージの配線を形成する。また、その銅膜形成用組成物を用いて、第１検知電極２３および第２検知電極２４等の設けられた透明基板２２上に塗膜を形成し、その塗膜を加熱して引き出し配線３１を形成し、電子機器であるタッチパネル２１を製造する。【選択図】図１