SUBSTRATE TREATMENT APPARATUS

PROBLEM TO BE SOLVED: To evenly apply coating liquid within a substrate surface while suppressing the supply amount of the coating liquid applied to the substrate to a small amount.SOLUTION: A substrate treatment apparatus 1 includes: a moving mechanism 20 for moving a wafer W in a horizontal direct...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	WAKAMOTO YUKIHIRO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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