SUBSTRATE TREATMENT APPARATUS

PROBLEM TO BE SOLVED: To evenly apply coating liquid within a substrate surface while suppressing the supply amount of the coating liquid applied to the substrate to a small amount.SOLUTION: A substrate treatment apparatus 1 includes: a moving mechanism 20 for moving a wafer W in a horizontal direction; application parts 30, 50 for discharging the coating liquid to the wafer W; dry parts 40, 60 for drying the coating liquid on the wafer W; and a control part 100 for controlling the moving mechanism 20, the application parts 30, 50 and the dry parts 40, 60. The wafer W is moved in the horizontal direction while being applied with the coating liquid at respective application parts 30, 50, thus the coating liquid is applied to the whole surface of the wafer W.SELECTED DRAWING: Figure 1 【課題】基板に塗布される塗布液の供給量を少量に抑制しつつ、当該塗布液を基板面内で均一に塗布する。【解決手段】基板処理装置１は、ウェハＷを水平方向に移動させる移動機構２０と、ウェハＷに塗布液を吐出する塗布部３０、５０と、ウェハＷ上の塗布液を乾燥させる乾燥部４０、６０と、移動機構２０、塗布部３０、５０及び乾燥部４０、６０を制御する制御部１００と、を有する。各塗布部３０、５０では、塗布液をウェハＷに接液させながら、ウェハＷを水平方向に移動させることで、ウェハＷの全面に塗布液を塗布する。【選択図】図１