SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a semiconductor device capable of achieving both solder flow prevention and suppression of burning of the laser processing residue.SOLUTION: A semiconductor device 100 comprises: a semiconductor chip 20; a plurality of insulation substrates 2 to each of which the sem...

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1. Verfasser:	HIGASHIDATE MAKOTO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a semiconductor device capable of achieving both solder flow prevention and suppression of burning of the laser processing residue.SOLUTION: A semiconductor device 100 comprises: a semiconductor chip 20; a plurality of insulation substrates 2 to each of which the semiconductor chip 20 is fixed; a heat sink 1 in which the plurality of insulation substrates 2 are respectively arranged in predetermined arrangement regions, and that has a first groove 3 surrounding each of the plurality of predetermined regions and a second groove 4 shallower than the first groove 3 and surrounding the first groove 3; and a solder 6 having filled the space between the insulation substrate 2 and the arrangement regions of the heat sink 1.SELECTED DRAWING: Figure 6 【課題】はんだ流れ防止とレーザー加工残渣の焼き付きの抑制を両立できる半導体装置を提供する。【解決手段】半導体装置１００は、半導体チップ２０と、半導体チップ２０が固定された複数の絶縁基板２と、複数の絶縁基板２がそれぞれ所定の配置領域に配置され、複数の所定領域のそれぞれを囲む第１溝３と、第１溝３よりも浅く第１溝３を囲む第２溝４を有するヒートシンク１と、絶縁基板２とヒートシンク１の配置領域との間に充填されたはんだ６とを備える。【選択図】図６