MANUFACTURING METHOD OF MOLDING DIE AND MOLDING DIE

PROBLEM TO BE SOLVED: To provide a manufacturing method of a molding die having a release layer excellent in coatability and durability and the molding die.SOLUTION: An codeposited plating layer 14 having the content of a resin particle of 31 vol% or more is formed by codepositing Ni or Ni alloy and the resin particle from a Ni-containing plating liquid where the resin particle consisting of a fluorine resin having melt flowability of melt viscosity of 1×10Pa s or less by using an ampholytic surfactant on a substrate 12 of a molding die and a release layer 16 consisting of a resin coating film having thickness in a range of 0.2 to 1.0 μm and thickness difference of 0.1 μm or less on a surface of the codeposited layer 14 by melting the resin particle on the surface of the codeposited plating layer 14.SELECTED DRAWING: Figure 1 【課題】被覆性および耐久性に優れる離型層を有する成形金型の製造方法および成形金型を提供すること。【解決手段】成形金型の基材１２上に、両性界面活性剤を用いて溶融粘度１?１０８Ｐａ・ｓ以下の溶融流動性を有するフッ素樹脂からなる樹脂粒子を分散したＮｉ含有めっき液からＮｉまたはＮｉ合金と樹脂粒子とを共析して樹脂粒子の含有量が３１体積％以上となる共析めっき層１４を形成し、共析めっき層１４の表面にある樹脂粒子を溶融して共析めっき層１４の表面に厚みが０．２〜１．０μｍの範囲内であり、かつ、厚み差が０．１μｍ以下の樹脂被膜からなる離型層１６を形成する。【選択図】図１