METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To provide an electronic device having excellent connectivity with a mounting substrate.SOLUTION: A method for manufacturing an electronic device performs: a step S11 of preparing a lead frame including a chip region in which a semiconductor chip is mounted and a plurality of terminal regions connected to the semiconductor chip; a step S13 of forming a package by injecting a resin into a mold so as to cover the region including the chip region and not including a tip of the terminal region; a step S14 of removing a region including some connection parts after the resin injecting step S13; and a step S15 of plating the region not covered by the resin among the terminal regions.SELECTED DRAWING: Figure 2 【課題】実装基板との接続性が良好な電子デバイスを提供する。【解決手段】半導体チップを実装するチップ領域と、半導体チップと接続される複数の端子領域とを有するリードフレームを準備する準備工程Ｓ１１と、チップ領域を含み、かつ端子領域の先端部を含まない領域を覆うように樹脂を注入してパッケージを形成する樹脂注入工程Ｓ１３と、樹脂注入工程Ｓ１３の後に、一部の接続部を含む領域を除去する除去工程Ｓ１４と、端子領域のうち、樹脂に覆われていない領域をメッキするメッキ工程Ｓ１５とを行う。【選択図】図２