METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic device capable of suppressing impairment of a circuit board, and to provide an electronic device.SOLUTION: An electronic device 100 includes a circuit board 10 including a base material 11 having a through hole 13 formed to penetrate one surface S1 of itself and the opposite surface S2 thereof, and provided with a conductive part 14, and a press fit terminal 20 press-fitted in the through hole 13 and connected electrically with the circuit board 10. A method of manufacturing the electronic device 100 includes a formation step for forming an insulation member 50 electrically insulating the press fit terminal 20 and a lid 32, at the tip of the press fit terminal 20, and a press fit step for press fitting the press fit terminal 20 into the through hole 13 from one surface S1 side, following to the formation step.SELECTED DRAWING: Figure 10 【課題】回路基板の損傷を抑制できる電子装置の製造方法及び電子装置を提供すること。【解決手段】電子装置１００は、自身の一面Ｓ１と一面の反対面Ｓ２に亘って貫通して形成されると共に導電部１４が設けられたスルーホール１３を有する基材１１を含む回路基板１０と、スルーホール１３に圧入されて回路基板１０と電気的に接続されている圧入端子２０とを備えている。この電子装置１００の製造方法は、圧入端子２０の先端に、圧入端子２０と蓋３２とを電気的に絶縁するための絶縁部材５０を形成する形成工程と、形成工程後に、圧入端子２０を一面Ｓ１側からスルーホール１３に圧入する圧入工程と、を備えている。【選択図】図１０