EPOXY RESIN COMPOSITION FOR SEALING AND ELECTRONIC COMPONENT DEVICE

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing which is excellent in moisture-resistant adhesion and low-stress properties, and to provide an electronic component device which includes an element sealed therewith, and has high reliability (moisture resistance and thermal-sho...

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Bibliographische Detailangaben
Hauptverfasser:	TSUCHIDA SATORU, KOSAKA MASAHIKO, OGATA MASAJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing which is excellent in moisture-resistant adhesion and low-stress properties, and to provide an electronic component device which includes an element sealed therewith, and has high reliability (moisture resistance and thermal-shock resistance).SOLUTION: The epoxy resin composition for sealing includes (A) a liquid epoxy resin, (B) a curing agent containing a liquid aromatic amine, (C) rubber particles, and (D) an inorganic filler. The electronic component device includes the element sealed with the epoxy resin composition for sealing.SELECTED DRAWING: None 【課題】耐湿接着力、低応力性に優れた封止用エポキシ樹脂組成物、及びこれにより封止された素子を備えた信頼性（耐湿性、耐熱衝撃性）の高い電子部品装置を提供する。【解決手段】（Ａ）液状エポキシ樹脂、（Ｂ）液状芳香族アミンを含む硬化剤、（Ｃ）ゴム粒子、および（Ｄ）無機充填剤を含有してなる封止用エポキシ樹脂組成物、ならびにこの封止用エポキシ樹脂組成物により封止された素子を備えた電子部品装置。【選択図】なし