SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR

PROBLEM TO BE SOLVED: To provide a technique for improving the film quality of a thin film formed on a substrate.SOLUTION: A semiconductor manufacturing apparatus includes: a substrate transfer mechanism which transfers a plurality of substrates arranged in one line along a conveyance path provided...

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Hauptverfasser: NUMATA TAKAYUKI, KONNO TAIICHIRO, FUJIKURA HAJIME, NONAKA TAKEHIRO
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a technique for improving the film quality of a thin film formed on a substrate.SOLUTION: A semiconductor manufacturing apparatus includes: a substrate transfer mechanism which transfers a plurality of substrates arranged in one line along a conveyance path provided in a first container so as to reach a carry-out port from a carry-in port, and carries the substrates into/out of a second container one by one; and drive parts for driving the substrate transfer mechanism, the drive parts being formed so as to be capable of separated from the substrate transfer mechanism provided in the first container, and being installed in a substrate carry-in chamber and a substrate carry-out chamber, respectively.SELECTED DRAWING: Figure 1 【課題】基板上に成膜される薄膜の膜質を向上させる技術を提供する。【解決手段】搬入口から搬出口に至るように第1の容器内に設けられた搬送経路に沿って複数の基板を一列に並べて搬送するとともに、第2の容器内外に順番に基板を搬入出する基板搬送機構を駆動させる駆動部は、第1の容器内に設けられる基板搬送機構と分離可能に形成されており、基板搬入室及び基板搬出室内にそれぞれ設置されている。【選択図】図1