METHOD OF MANUFACTURING ELECTRONIC COMPONENT MOUNTING BOARD, APPARATUS FOR MANUFACTURING ELECTRONIC COMPONENT MOUNTING BOARD AND ELECTRONIC COMPONENT MOUNT DEVICE

PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component mount board, an apparatus for manufacturing an electronic component mount board and an electronic component mount device that enable miniaturization of a board by effectively using a vain area occurring when a half-etch mask is used for solder printing.SOLUTION: In an application example in which a half-etch mask type screen mask 10 which is partially different in mask thickness and has a step portion 12 is used for screen printing for solder connection when an electronic component mount board 20 is manufactured, a resistance body R which can be formed by coating resistance body paste R* is disposed in the range corresponding to a print unstable area 10C sandwiching the step portion 12 on a board 3. Accordingly, a mount area which has been conventionally a vain area because an electronic component as a solder-joint target on a board 3 cannot be disposed on the mount area can be effectively used.SELECTED DRAWING: Figure 3 【課題】はんだ印刷にハーフエッチマスクを用いる場合に生じる無駄なエリアを有効に活用して、基板のコンパクト化を図ることができる電子部品実装基板の製造方法及び電子部品実装基板の製造装置並びに電子部品搭載装置を提供する。【解決手段】電子部品実装基板２０の製造に際し、はんだ接続用のスクリーン印刷においてマスク厚みが部分的に異なり段差部１２を有するハーフエッチマスク形式のスクリーンマスク１０を用いる適用例において、基板３において段差部１２を挟んだ印刷不安定領域１０Ｃに対応する範囲に，抵抗体ペーストＲ＊の塗布によって形成可能な抵抗体Ｒを配置する。これにより、従来は基板３においてはんだ接合の対象となる電子部品を配置することができずに無駄なエリアとなっていた実装面を有効に活用することができる。【選択図】図３