ADHESIVE COMPOSITION FOR PRINTED WIRING BOARD, BONDING FILM FOR PRINTED WIRING BOARD, COVERLAY FOR PRINTED WIRING BOARD, COPPER-CLAD LAMINATE, AND PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide an adhesive composition for a printed wiring board, which can maintain high adhesiveness for a long time in a high temperature environment and has excellent heat resistance, a bonding film for a printed wiring board, a coverlay for a printed wiring board, a copper-cl...

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Bibliographische Detailangaben
Hauptverfasser:	KAKIMOTO MASAYA, UCHIDA YOSHIFUMI, SUGAWARA JUN, KAIMORI SHINGO, ASAI SHOGO, YONEZAWA TAKAYUKI, KAMIMURA SHIGEAKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an adhesive composition for a printed wiring board, which can maintain high adhesiveness for a long time in a high temperature environment and has excellent heat resistance, a bonding film for a printed wiring board, a coverlay for a printed wiring board, a copper-clad laminate, and a printed wiring board.SOLUTION: The adhesive composition for a printed wiring board comprises a siloxane-modified polyimide and an epoxy resin, in which the epoxy resin is included by 1 to 10 parts by mass with respect to 100 parts by mass of the siloxane-modified polyimide. The composition has a sea-island structure in which the siloxane-modified polyimide is regarded as the sea phase while the epoxy resin is regarded as the island phase, and an average diameter of the island phase is 1 μm or less.SELECTED DRAWING: None 【課題】高温環境下で長時間高い接着性を維持でき、耐熱性に優れるプリント配線板用接着剤組成物、プリント配線板用ボンディングフィルム、プリント配線板用カバーレイ、銅張積層板及びプリント配線板を提供する。【解決手段】シロキサン変性ポリイミド及びエポキシ樹脂を含有し、エポキシ樹脂の含有量がシロキサン変性ポリイミド１００質量部に対して１〜１０質量部であり、シロキサン変性ポリイミドを海、エポキシ樹脂を島とする海島構造を有し、この島相の平均径が１μｍ以下であるプリント配線板用接着剤組成物。【選択図】なし