RESIN SHEET AND PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a resin composition which, when used for an insulating layer in a printed wiring board material, achieves excellent handleability of a resin sheet and excellent adhesion between the insulating layer and a conductor layer formed by plating on a surface of the insulati...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	IDEI HIDEKAZU, YOTSUYA SEIJI, MABUCHI YOSHINORI, HASEBE KEIICHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING
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