SUBSTRATE HOLDER, PLATING DEVICE PROVIDED WITH SUBSTRATE HOLDER AND PLATING METHOD

PROBLEM TO BE SOLVED: To provide a substrate holder capable of flowing a uniform current through a substrate.SOLUTION: Provided is a substrate holder provided with: a plurality of internal contacts 45 contacted with the peripheral part of a substrate W; a plurality of external contacts 42 with elasticity respectively having contact faces 42a contacted with a power feed terminal 51 contacted to a power source 18 and respectively connected to a plurality of the internal contacts 45; a conductor block 60 arranged at the back side of the contact faces 42a; and an energizing member 63 of pressing the conductor block 60 against a plurality of the external contacts 42. 【課題】基板に均一な電流を流すことができる基板ホルダを提供する。【解決手段】基板ホルダは、基板Ｗの周縁部に接触する複数の内部接点４５と、電源１８に接続された給電端子５１に接触する接触面４２ａをそれぞれ有し、複数の内部接点４５にそれぞれ接続された弾性を有する複数の外部接点４２と、接触面４２ａの裏側に配置された導体ブロック６０と、導体ブロック６０を複数の外部接点４２に押し付ける付勢部材６３とを備える。【選択図】図９