CONJUGATE AND PRODUCTION METHOD THEREOF

PROBLEM TO BE SOLVED: To provide inexpensively a conjugate joinable at room temperature in an air atmosphere without requiring special device, work or the like, and excellent in mechanical strength and durability.SOLUTION: A conjugate includes a joined material (X), a soft material (Z) and another j...

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Bibliographische Detailangaben
Hauptverfasser:	SASAKI HARUKA, YAMAMOTO ATSUSHI, KURI YUUJI, HORIKAWA DAISUKE
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide inexpensively a conjugate joinable at room temperature in an air atmosphere without requiring special device, work or the like, and excellent in mechanical strength and durability.SOLUTION: A conjugate includes a joined material (X), a soft material (Z) and another joined material (Y), and further includes a gold thin film layer (A) arranged between the joined material (X) and the soft material (Z), and a gold thin film layer (B) arranged between the soft material (Z) and another joined material (Y). A production method of the conjugate is also provided. 【課題】特殊な装置や作業等を必要とせずに、常温、大気雰囲気中で接合可能で、機械的強度ならびに耐久性が良好な接合体を、安価に提供する。【解決手段】被接合物(Ｘ)と、軟質材(Ｚ)と、他の被接合物(Ｙ)とを含み、前記の被接合物(Ｘ)と前記の軟質材(Ｚ)との間に配置された金薄膜層(Ａ)および前記の軟質材(Ｚ)と前記の他の被接合物(Ｙ)との間に配置された金薄膜層(Ｂ)を含んでなるものであることを特徴とする接合体、およびこの接合体の製造方法。【選択図】図１