PROCESS LIQUID PIPE FITTING FOR SEMICONDUCTOR PRODUCTION
PROBLEM TO BE SOLVED: To perform replacement work of a container for reserving process liquid, in a short time without using a tool or the like.SOLUTION: In a pipe fitting 1 including a body 30 used for pipes 20, 21 where the process liquid for semiconductor production flowing therethrough has a pos...
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| creator | NAKAJIMA TSUNENAGA NISHIDA YUICHI |
| description | PROBLEM TO BE SOLVED: To perform replacement work of a container for reserving process liquid, in a short time without using a tool or the like.SOLUTION: In a pipe fitting 1 including a body 30 used for pipes 20, 21 where the process liquid for semiconductor production flowing therethrough has a positive pressure, and into which the pipes 20, 21 are inserted, and nuts 40, 41 being screwed over the body 30 and fastening the pipe inserted thereinto thus connecting the body 30 and the pipes 20, 21, external diameter of the nuts 40, 41 is two times or more of the external diameter of the pipes 20, 21 inserted into the body 30. On the outer peripheral surface of the nuts 40, 41, grips 40c, 41a are formed at more than one points of a protrusion and a recess formed in the length direction of the pipes 20, 21.
【課題】処理液貯留用の容器の交換作業を、工具等を用いることなく短時間で行う。【解決手段】内部を流れる半導体製造用の処理液が正圧となる配管２０、２１に用いられ、配管２０、２１が挿入される本体部３０と、本体部３０と螺合することで本体部３０に挿入される配管を締め付けて本体部３０と配管２０、２１を接続するナット部４０、４１と、を備えた配管用継手１であって、ナット部４０、４１の外径は、本体部３０に挿入される配管２０、２１の外径の２倍以上である。ナット部４０、４１の外周面には、配管２０、２１の長さ方向に沿って形成された凸状の突起部と凹状の窪み部により形成されたグリップ部４０ｃ、４１ａが、少なくとも一箇所以上に形成されている。【選択図】図２ |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2015228437A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2015228437A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2015228437A3</originalsourceid><addsrcrecordid>eNrjZLAICPJ3dg0OVvDxDAz1dFEI8AxwVXDzDAnx9HNXcPMPUgh29fV09vdzCXUOAfKAqkEsT38_HgbWtMSc4lReKM3NoOTmGuLsoZtakB-fWlyQmJyal1oS7xVgZGBoamRkYWJs7mhMlCIA3IQpTg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PROCESS LIQUID PIPE FITTING FOR SEMICONDUCTOR PRODUCTION</title><source>esp@cenet</source><creator>NAKAJIMA TSUNENAGA ; NISHIDA YUICHI</creator><creatorcontrib>NAKAJIMA TSUNENAGA ; NISHIDA YUICHI</creatorcontrib><description>PROBLEM TO BE SOLVED: To perform replacement work of a container for reserving process liquid, in a short time without using a tool or the like.SOLUTION: In a pipe fitting 1 including a body 30 used for pipes 20, 21 where the process liquid for semiconductor production flowing therethrough has a positive pressure, and into which the pipes 20, 21 are inserted, and nuts 40, 41 being screwed over the body 30 and fastening the pipe inserted thereinto thus connecting the body 30 and the pipes 20, 21, external diameter of the nuts 40, 41 is two times or more of the external diameter of the pipes 20, 21 inserted into the body 30. On the outer peripheral surface of the nuts 40, 41, grips 40c, 41a are formed at more than one points of a protrusion and a recess formed in the length direction of the pipes 20, 21.
【課題】処理液貯留用の容器の交換作業を、工具等を用いることなく短時間で行う。【解決手段】内部を流れる半導体製造用の処理液が正圧となる配管２０、２１に用いられ、配管２０、２１が挿入される本体部３０と、本体部３０と螺合することで本体部３０に挿入される配管を締め付けて本体部３０と配管２０、２１を接続するナット部４０、４１と、を備えた配管用継手１であって、ナット部４０、４１の外径は、本体部３０に挿入される配管２０、２１の外径の２倍以上である。ナット部４０、４１の外周面には、配管２０、２１の長さ方向に沿って形成された凸状の突起部と凹状の窪み部により形成されたグリップ部４０ｃ、４１ａが、少なくとも一箇所以上に形成されている。【選択図】図２</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ENGINEERING ELEMENTS AND UNITS ; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS ; HEATING ; JOINTS OR FITTINGS FOR PIPES ; LIGHTING ; MEANS FOR THERMAL INSULATION IN GENERAL ; MECHANICAL ENGINEERING ; PIPES ; SEMICONDUCTOR DEVICES ; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING ; THERMAL INSULATION IN GENERAL ; WEAPONS</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20151217&DB=EPODOC&CC=JP&NR=2015228437A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20151217&DB=EPODOC&CC=JP&NR=2015228437A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAKAJIMA TSUNENAGA</creatorcontrib><creatorcontrib>NISHIDA YUICHI</creatorcontrib><title>PROCESS LIQUID PIPE FITTING FOR SEMICONDUCTOR PRODUCTION</title><description>PROBLEM TO BE SOLVED: To perform replacement work of a container for reserving process liquid, in a short time without using a tool or the like.SOLUTION: In a pipe fitting 1 including a body 30 used for pipes 20, 21 where the process liquid for semiconductor production flowing therethrough has a positive pressure, and into which the pipes 20, 21 are inserted, and nuts 40, 41 being screwed over the body 30 and fastening the pipe inserted thereinto thus connecting the body 30 and the pipes 20, 21, external diameter of the nuts 40, 41 is two times or more of the external diameter of the pipes 20, 21 inserted into the body 30. On the outer peripheral surface of the nuts 40, 41, grips 40c, 41a are formed at more than one points of a protrusion and a recess formed in the length direction of the pipes 20, 21.
【課題】処理液貯留用の容器の交換作業を、工具等を用いることなく短時間で行う。【解決手段】内部を流れる半導体製造用の処理液が正圧となる配管２０、２１に用いられ、配管２０、２１が挿入される本体部３０と、本体部３０と螺合することで本体部３０に挿入される配管を締め付けて本体部３０と配管２０、２１を接続するナット部４０、４１と、を備えた配管用継手１であって、ナット部４０、４１の外径は、本体部３０に挿入される配管２０、２１の外径の２倍以上である。ナット部４０、４１の外周面には、配管２０、２１の長さ方向に沿って形成された凸状の突起部と凹状の窪み部により形成されたグリップ部４０ｃ、４１ａが、少なくとも一箇所以上に形成されている。【選択図】図２</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ENGINEERING ELEMENTS AND UNITS</subject><subject>GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS</subject><subject>HEATING</subject><subject>JOINTS OR FITTINGS FOR PIPES</subject><subject>LIGHTING</subject><subject>MEANS FOR THERMAL INSULATION IN GENERAL</subject><subject>MECHANICAL ENGINEERING</subject><subject>PIPES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING</subject><subject>THERMAL INSULATION IN GENERAL</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAICPJ3dg0OVvDxDAz1dFEI8AxwVXDzDAnx9HNXcPMPUgh29fV09vdzCXUOAfKAqkEsT38_HgbWtMSc4lReKM3NoOTmGuLsoZtakB-fWlyQmJyal1oS7xVgZGBoamRkYWJs7mhMlCIA3IQpTg</recordid><startdate>20151217</startdate><enddate>20151217</enddate><creator>NAKAJIMA TSUNENAGA</creator><creator>NISHIDA YUICHI</creator><scope>EVB</scope></search><sort><creationdate>20151217</creationdate><title>PROCESS LIQUID PIPE FITTING FOR SEMICONDUCTOR PRODUCTION</title><author>NAKAJIMA TSUNENAGA ; NISHIDA YUICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2015228437A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2015</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ENGINEERING ELEMENTS AND UNITS</topic><topic>GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS</topic><topic>HEATING</topic><topic>JOINTS OR FITTINGS FOR PIPES</topic><topic>LIGHTING</topic><topic>MEANS FOR THERMAL INSULATION IN GENERAL</topic><topic>MECHANICAL ENGINEERING</topic><topic>PIPES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING</topic><topic>THERMAL INSULATION IN GENERAL</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>NAKAJIMA TSUNENAGA</creatorcontrib><creatorcontrib>NISHIDA YUICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAKAJIMA TSUNENAGA</au><au>NISHIDA YUICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PROCESS LIQUID PIPE FITTING FOR SEMICONDUCTOR PRODUCTION</title><date>2015-12-17</date><risdate>2015</risdate><abstract>PROBLEM TO BE SOLVED: To perform replacement work of a container for reserving process liquid, in a short time without using a tool or the like.SOLUTION: In a pipe fitting 1 including a body 30 used for pipes 20, 21 where the process liquid for semiconductor production flowing therethrough has a positive pressure, and into which the pipes 20, 21 are inserted, and nuts 40, 41 being screwed over the body 30 and fastening the pipe inserted thereinto thus connecting the body 30 and the pipes 20, 21, external diameter of the nuts 40, 41 is two times or more of the external diameter of the pipes 20, 21 inserted into the body 30. On the outer peripheral surface of the nuts 40, 41, grips 40c, 41a are formed at more than one points of a protrusion and a recess formed in the length direction of the pipes 20, 21.
【課題】処理液貯留用の容器の交換作業を、工具等を用いることなく短時間で行う。【解決手段】内部を流れる半導体製造用の処理液が正圧となる配管２０、２１に用いられ、配管２０、２１が挿入される本体部３０と、本体部３０と螺合することで本体部３０に挿入される配管を締め付けて本体部３０と配管２０、２１を接続するナット部４０、４１と、を備えた配管用継手１であって、ナット部４０、４１の外径は、本体部３０に挿入される配管２０、２１の外径の２倍以上である。ナット部４０、４１の外周面には、配管２０、２１の長さ方向に沿って形成された凸状の突起部と凹状の窪み部により形成されたグリップ部４０ｃ、４１ａが、少なくとも一箇所以上に形成されている。【選択図】図２</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING JOINTS OR FITTINGS FOR PIPES LIGHTING MEANS FOR THERMAL INSULATION IN GENERAL MECHANICAL ENGINEERING PIPES SEMICONDUCTOR DEVICES SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING THERMAL INSULATION IN GENERAL WEAPONS |
| title | PROCESS LIQUID PIPE FITTING FOR SEMICONDUCTOR PRODUCTION |
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