COATING TREATMENT DEVICE

PROBLEM TO BE SOLVED: To apply a coating liquid uniformly in a substrate.SOLUTION: At a time T1 of starting coating, when a first end of a discharge port of a coating nozzle is positioned at one end of a wafer circumference, a coating liquid is exposed from the discharge port, and at the same time, a wafer and the coating nozzle are relatively moved by a mover mechanism. From a time T2 to a time T3 during coating, the coating liquid discharged from the discharge port is brought into liquid contact with the wafer, and at the same time, the wafer and the coating nozzle are relatively moved by the mover mechanism and the coating liquid is applied onto the wafer. At a time of T3 of ending coating, when a second end of the discharge port is positioned at the other end of the wafer circumference, the coating liquid is exposed from the discharge port, and at the same time, the wafer and the coating nozzle are relatively moved by the mover mechanism. 【課題】基板面内で均一に塗布液を塗布する。【解決手段】塗布開始時の時間Ｔ１では、塗布ノズルの吐出口の第１端部がウェハ周縁の一端部に位置した際に、吐出口から塗布液を露出させつつ、移動機構によってウェハと塗布ノズルを相対的に移動させる。塗布中の時間Ｔ２から時間Ｔ３では、吐出口から吐出された塗布液をウェハに接液させながら、移動機構によってウェハと塗布ノズルを相対的に移動させて、ウェハに塗布液を塗布する。塗布終了時の時間Ｔ３では、吐出口の第２端部がウェハ周縁の他端部に位置した際に、吐出口から塗布液を露出させつつ、移動機構によってウェハと塗布ノズルを相対的に移動させる。【選択図】図５