SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To provide a semiconductor device in which wet spread of an adhesive material for bonding a semiconductor element to a base substrate.SOLUTION: In a semiconductor device (100) of the present embodiment is a semiconductor device in which a semiconductor element (20) is bonded to...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; jpn |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a semiconductor device in which wet spread of an adhesive material for bonding a semiconductor element to a base substrate.SOLUTION: In a semiconductor device (100) of the present embodiment is a semiconductor device in which a semiconductor element (20) is bonded to a base substrate (10) by an adhesive material (30), the adhesive material (30) contains surface treated particles (40) or particles (40) accompanying a dispersant; and at least a part of an edge (301) of the adhesive material is a region where the particles (40) are eccentrically located.
【課題】半導体素子を基体に接着する接着材の濡れ広がりが抑えられた半導体装置を提供する。【解決手段】本発明の半導体装置(100)は、基体(10)上に半導体素子(20)が接着材(30)により接着された半導体装置であって、前記接着材(30)は、表面処理された粒子(40)、又は分散剤と共存する粒子(40)を含有し、前記接着材の縁部(301)の少なくとも一部は、前記粒子(40)が偏在する領域であることを特徴とする。【選択図】図１ |
|---|