SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

PROBLEM TO BE SOLVED: To provide a semiconductor device which can store a capacitor in a space-saving manner between packages above and below which are connected.SOLUTION: A semiconductor device comprises a first semiconductor package 1 which includes: a first substrate 2; a first electrode 2a and a second electrode 2b which are formed on the first substrate 2; a first semiconductor chip 5 attached on the first substrate 2; and a capacitor 10 which has a bottom electrode 11 having a first lead frame 11a which is formed above the first semiconductor chip 5 and connected to the first electrode 2a on a first side of the first semiconductor chip 5, a dielectric film 12 formed on the bottom electrode 11, and an upper electrode 13 which is formed on the dielectric film 12 and has a second lead frame 13a connected to the second electrode 13 on a second side of the first semiconductor chip. 【課題】上下に接続されるパッケージの間にコンデンサを省スペースで収納できる半導体装置を提供する。【解決手段】第１基板２と、第１の基板２に形成される第１電極２ａ及び第２電極２ｂと、第１の基板２の上方に取り付けられる第１の半導体チップ５とを有する第１の半導体パッケージ１において、第１の半導体チップ５の上方に形成され、第１の半導体チップ５の第１側方で第１電極２ａに接続される第１のリードフレーム１１ａを有する下部電極１１と、下部電極１１の上に形成される誘電体膜１２と、誘電体膜１２上に形成され、第１の半導体チップの第２の側方で第２電極１３に接続される第２のリードフレーム１３ａを有する上部電極１３と、を有するコンデンサ１０を含む。【選択図】図１