ELECTRIC CIRCUIT DEVICE
PROBLEM TO BE SOLVED: To provide an electric circuit device which achieves simplification of the structure and adds proper element cooling capability.SOLUTION: An electric power conversion system 10 includes a semiconductor element 27 which generates heat while being operated. The electric power con...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide an electric circuit device which achieves simplification of the structure and adds proper element cooling capability.SOLUTION: An electric power conversion system 10 includes a semiconductor element 27 which generates heat while being operated. The electric power conversion system 10 includes: a case body 13 having an element cooling function; a plate-like heat receiving part 32 which is provided at the case body 13 and has a heat receiving surface with which an outer surface of the semiconductor element 27 contacts; and a clip 40 which sandwiches the semiconductor element 27 and the heat receiving part 32 with a pair of holding parts 41 in a state where the outer surface of the semiconductor element 27 and the heat receiving surface of the heat receiving part 32 contact with each other and which maintains the contact state with an elastic force.
【課題】構成の簡易化を図りつつ、適正な素子冷却性能を付加することができる電気回路装置を提供する。【解決手段】電力変換装置10は、動作に伴い発熱する半導体素子27を有している。電力変換装置10は、素子冷却機能を有するケース本体13と、ケース本体13に設けられ、半導体素子27の外面を当接させる受熱面を有する板状の受熱部32と、半導体素子27の外面と受熱部32の受熱面とを互いに当接させた状態で、これら半導体素子27及び受熱部32を一対の挟持部41で挟み込み、弾性力により当該当接状態を保持するクリップ40と、を備えている。【選択図】 図1 |
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