METHOD AND APPARATUS FOR PRODUCING RESINOUS MICRO-FLOW PATH DEVICE
PROBLEM TO BE SOLVED: To provide a method for producing a resinous micro-flow path device, in which when a resin substrate to be obtained by injection molding is joined to a resin film for covering a flow path and the resin substrate thus joined is used as the micro-flow path device, every corners o...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a method for producing a resinous micro-flow path device, in which when a resin substrate to be obtained by injection molding is joined to a resin film for covering a flow path and the resin substrate thus joined is used as the micro-flow path device, every corners of the flow path are welded so that a joining failure is not generated.SOLUTION: In the method for producing the resinous micro-flow path device 100, when the first resin substrate 2 having a flow path on at the least one surface thereof is superposed, heated and press-fixed to the second resin substrate 3 for covering the first resin substrate 2 by using a heating press having a metal block, a protective resin sheet 5 is further superposed, heated and press-fixed to the outside of the second resin substrate 3. The glass transition temperature of the protective resin sheet 5 is made higher than that of the second resin substrate 3 by 20°C or more.
【課題】射出成形で得られる樹脂基板と流路を覆うための樹脂フィルムを結合させてマイクロ流路デバイスとして用いる場合に、流路の淵まで溶着し接合不良を生じさせないマイクロ流路デバイスの製造方法の提供。【解決手段】少なくとも一方の面に流路を有する第一樹脂基板2と、第一樹脂基板2を覆うための第二樹脂基板3を重ね金属ブロックを有する加熱プレスで加熱圧着させ貼り合わせる際に、さらに第二樹脂基板3の外側に保護樹脂シート5を重ね加熱圧着させる樹脂製マイクロ流路デバイス100の製造方法。保護樹脂シート5のガラス転移温度が第二樹脂基板3のガラス転移温度より20℃以上高い、樹脂製マイクロ流路デバイスの製造方法【選択図】図3 |
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