ANISOTROPIC CONDUCTIVE MATERIAL AND CONNECTING STRUCTURE

PROBLEM TO BE SOLVED: To provide a conductive particle which, when a connection structure is obtained by connecting between electrodes, hardly increases connection resistance between the electrodes even if the connection structure is exposed to high temperature and high humidity, and to provide a connection structure using the conductive particle.SOLUTION: There is provided a conductive particle which comprises a substrate particle 2, a copper layer 3 provided on the surface 2a of the substrate particle 2 and a palladium layer 4 provided on the surface of the copper layer 3. The palladium layer 4 has an average thickness of 5 to 500 nm. A copper ion concentration eluted when 100 pts.wt. of a plurality of conductive particles 1 are immersed in 1000 pts.wt. of 0.001 N nitric acid for one minute at 25°C is 5 ppm/cmor less per unit surface area of the conductive particle 1. 【課題】電極間を接続して接続構造体を得た場合に、該接続構造体が高温高湿下に晒されても、電極間の接続抵抗が高くなり難い導電性粒子、並びに該導電性粒子を用いた接続構造体を提供する。【解決手段】本発明に係る導電性粒子１は、基材粒子２と、該基材粒子２の表面２ａに設けられた銅層３と、該銅層３の表面３ａに設けられたパラジウム層４とを備える。パラジウム層４の平均厚みは５〜５００ｎｍである。複数の導電性粒子１の１００重量部を０．００１Ｎ硝酸１０００重量部に２５℃で１分間浸漬しときに、溶出する銅イオン濃度は、導電性粒子１の単位表面積当たり５ｐｐｍ／ｃｍ２以下である。【選択図】図１