MULTILAYER CERAMIC WIRING BOARD

PROBLEM TO BE SOLVED: To provide a multi-layer ceramic wiring board in which one end face of a non-conductive veer conductor insulated from a wiring layer in a substrate in part of a conductor pattern exposed from the surface of the substrate, which is formed from low-temperature fired ceramic layers arranged in layers, or a pad surface connected to the one end face are coated with an Au plating layer free from abnormal color tone.SOLUTION: A multi-layer ceramic wiring board 1 comprises: a substrate body 2 composed of ceramic layers C1 to C3 arranged in layers and having a surface 3 and a back 4; a non-conductive veer conductor 5 extending through the ceramic layer C1 and not electrically connected to another veer conductor 10; and a pad 7 connected to the lower-end face of the non-conductive veer conductor 5 and located between ceramic layers C1, C2. The conductivity of the non-conductive veer conductor 5 and the pad 7 is not lower than 55.0×10S/m. The area A1 of the end face of the non-conductive veer conductor 5, exposed from the surface 3, is not smaller than 7.0×10μm. The end face of the non-conductive veer conductor 5, which is exposed from the surface 3, is coated with an Au plating layer 9. 【課題】低温焼成セラミック層を積層した基板表面に露出する導体パターンの一部で基板内の配線層と絶縁されている非導通ビア導体の一端面、または該一端面に接続されたパッド表面に色調異常のないＡｕメッキ層が被覆された多層セラミック配線基板。【解決手段】セラミック層Ｃ１〜Ｃ３を積層してなり、表面３および裏面４を有する基板本体２と、セラミック層Ｃ１を貫通し、別のビア導体１０とは電気的に接続されない非導通ビア導体５と、非導通ビア導体５の下端面に接続され、セラミック層Ｃ１，Ｃ２間に位置するパッド７と、を備えた多層セラミック配線基板１であって、非導通ビア導体５およびパッド７の導電率は、５５．０?１０6Ｓ／ｍ以上で、非導通ビア導体５の上記表面３に露出する端面の面積Ａ１が、７．０?１０３μｍ2以上であり、非導通ビア導体５の上記表面３に露出する端面には、Ａｕメッキ層９が被覆されている、多層セラミック配線基板１。【選択図】図２