ELECTROLESS-PLATING METHOD, AND ELECTROLESS-PLATED ARTICLE

PROBLEM TO BE SOLVED: To provide a technique capable of performing a homogeneous plating deposition, even if the plated article is a high strength fiber such as a polyarylate fiber, a para-aramid fiber, or a POB fiber, while avoiding the strength reduction of a textile material, as accompanying a pl...

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Hauptverfasser: TAKAMATSU AKIRA, ASAMI ETSUO, TAKASHIMA SEIGO, HARA HIDEKI, KUME MICHIYUKI, HAYAKAWA MASAHIRO
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a technique capable of performing a homogeneous plating deposition, even if the plated article is a high strength fiber such as a polyarylate fiber, a para-aramid fiber, or a POB fiber, while avoiding the strength reduction of a textile material, as accompanying a plating pretreatment, and forming a plating film excellent in adhesion.SOLUTION: An electroless-plating method including a PD system catalyst carrying step, a PD system catalyst activating step and an electroless plating step, includes a plating pretreatment liquid dipping step of dipping a related article having a surface charged negative, in a plating pretreatment liquid, prior to said Pd system catalyst carrying step. Said plating pretreatment liquid used is an alkaline cation group polymer aqueous solution obtained by dissolving the water-soluble cation polymer in water, and contains an element having unshared electron pairs. 【課題】めっき前処理に伴う繊維材料の強度低下を回避しつつ、被めっき物がポリアリレート繊維、パラ系アラミド繊維、POB繊維等の高強度繊維であっても、均一なめっき析出が可能であって、密着性に優れためっき皮膜を形成することができる技術を提供すること。【解決手段】Pd系触媒担持工程と、Pd系触媒活性化工程と、無電解めっき工程を有する無電解めっき方法において、前記Pd系触媒担持工程に先立って、表面が負に帯電した被めっき物を、めっき前処理液に浸漬させるめっき前処理液浸漬工程を有し、該めっき前処理液として、水溶性カチオン系ポリマーを水に溶解させて得た、アルカリ性のカチオン系ポリマー水溶液であって、非共有電子対を有する元素を含有するものを用いる。【選択図】図2