LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD

PROBLEM TO BE SOLVED: To prevent decline of hole quality or hole diameter accuracy caused by fluctuation of a laser beam emission start time.SOLUTION: A laser processing apparatus includes a photodetector 3 for detecting a laser beam emitted from a laser oscillator 1. After a fixed time after a lase...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KUDO TAKAHIRO, OSAKA YOSHIHISA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DEVICES USING STIMULATED EMISSION ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!